The future expanded by generative AI and the increasing burden behind it
The use of generative AI is expanding daily, and the burden on servers is also increasing rapidly. Some projections indicate that electricity consumption could triple over the next five years. As the development of compact LLMs optimized for Japanese continues, the automotive sector, including autonomous driving, is advancing the use of generative AI and demanding faster data processing. Given these circumstances, the load on equipment is expected to increase for the near future.
The trend toward higher density in automotive semiconductors is accelerating.
Unlike the smartphone industry, the automotive semiconductor industry has not prioritized functional safety and cost efficiency over aggressive miniaturization. Although 20-nm-class chips are still mainstream today, Chinese BEV manufacturer NIO is accelerating the adoption of compact semiconductors with a 5-nm pitch comparable to that of smartphones developed in-house. To maximize the effective area of components, 3D substrate technology is also advancing.
New challenges of heat caused by high-density development
As circuits become denser and data processing speeds up, the next challenge is thermal management. The use of resins with higher thermal stability for substrates is expanding. Cooling technology has of course evolved, but the perspective of how to manage heat is essential not only for the substrate but also for material selection in peripheral components like the casing.
The concept of not only withstanding heat but also not generating heat
The benchmark for material selection used to be how many degrees Celsius a material could withstand, but that alone is no longer sufficient. The important thing is a new perspective: Material that does not generate heat. One key factor is how to lower the dielectric constant. The molecules and fillers that make up plastic resonate at specific frequencies, generating heat through their own intense movement. This also causes localized thermal fatigue.
The best design can only be achieved by understanding resin properties.
Even when no visible thermal deformation is present, it is not uncommon for thermal fatigue to progress in specific areas due to the shape hindering heat dissipation. To achieve high-level thermal management, design based on a deep understanding of the characteristics and suitability of each resin is essential.
Plastic experts are here to support you.
As experts in the field, Starlite provides end-to-end solutions from concept to completion. From material selection to thermal management, feel free to consult with us anytime.